| (a) Qualification Testing |
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Temp Shock/Cycle |
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Power Cycling |
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HAST / Temp Humidity Bias / PCT |
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HTOL / LTOL |
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Bake |
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JEDEC Pre-Conditioning |
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Gate Leakage Test |
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Bond/Die/Lead Stress Analysis |
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Assembly Process Resistance |
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Studies/Simulations / IPC Surface Resistance Insulation Testing |
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ESD/Latch-Up Testing |
| (b) Complete Hi-Rel Reliability/Environmental Processing |
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Group B, C, and D devices per requirement of MIL-PRF-38535 and MIL-STD-883 |
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Group B Tests (Per MIL-STD-883, TM5005 - All Class) |
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Group C Tests (Per MIL-STD-883, TM5005 - All Class) |
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Group D ((Per MIL-STD-883, TM5005) |
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Group D |
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Physical Dimensions |
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Lead Integrity |
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Thermal Shock/Temp Cycling |
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Moisture Resistance |
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Fine & Gross Leak |
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Mechanical Shock |
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Vibration - (Variable Frequency) / Constant Acceleration- Centrifuge) |
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Salt Atmosphere |
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Internal Water-Vapor Content |
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Adhesion of Lead Finish |