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System, Module and Component Level Reliability
Climatic Environmental Tests |
| • Temperature & Humidity (Damp Heat) |
| • Dry Heat |
| • Low Temperature |
| • Temperature Cycle |
| • Thermal Shock |
| • Temperature, High Altitude, Low Air Pressure |
| • Salt Spray |
Mechanical Stress |
| • Pull/Shear |
| • Board Bending |
| • Torque |
| • Connector Life |
| • Dye/Pry |
| • Durability/Mating Test |
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Pb-free Reliability Engineering |
| • Lead-free Reliability Introduction |
| • Assembly Inspection |
| • Lead-free Component Reliability |
| • Lead-free System Reliability |
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Industrial/Outdoor Environmental Test |
| • Gas Corrosion Test (Flowing Mixed Gas) |
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Dynamic Environmental Tests |
| • Vibration |
| • Mechanical Shock |
| • Bump & Bounce |
| • Drop Test |
| • Seismic/Earthquake Vibration |
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Component Reliability |
| • Heat Resistance & Solderability |
| • Thermal Shock (Air to Air & Liquid to Liquid) |
| • Moisture Sensitivity Level |
| • ESD & Latch-up |
| • Operation Life Test |
| • Highly Accelerated Stress Test |
| • Pressure Cook |
| • Preconditioning |
| • Vibration |
| • Mechanical Shock |
Failure Analysis |
| • Electrical Property Analysis |
| • BGA Solder Ball Inspection |
| • X-Ray Inspection |
| • 3D CT X-Ray |
| • Scanning Acoustic Tomography (SAT) |
| • Cross Section |
| • Material Analysis |
Design Verification |
| • HALT/HASS |
| • Reliability Demonstration (MTBF) |
| • Acoustic Noise (Sound Pressure & Sound Power) |
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