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System, Module and Component Level Reliability
Climatic Environmental Tests |
• Temperature & Humidity (Damp Heat) |
• Dry Heat |
• Low Temperature |
• Temperature Cycle |
• Thermal Shock |
• Temperature, High Altitude, Low Air Pressure |
• Salt Spray |
Mechanical Stress |
• Pull/Shear |
• Board Bending |
• Torque |
• Connector Life |
• Dye/Pry |
• Durability/Mating Test |
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 Pb-free Reliability Engineering |
• Lead-free Reliability Introduction |
• Assembly Inspection |
• Lead-free Component Reliability |
• Lead-free System Reliability |
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Industrial/Outdoor Environmental Test |
• Gas Corrosion Test (Flowing Mixed Gas) |
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Dynamic Environmental Tests |
• Vibration |
• Mechanical Shock |
• Bump & Bounce |
• Drop Test |
• Seismic/Earthquake Vibration |
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 Component Reliability |
• Heat Resistance & Solderability |
• Thermal Shock (Air to Air & Liquid to Liquid) |
• Moisture Sensitivity Level |
• ESD & Latch-up |
• Operation Life Test |
• Highly Accelerated Stress Test |
• Pressure Cook |
• Preconditioning |
• Vibration |
• Mechanical Shock |
 Failure Analysis |
• Electrical Property Analysis |
• BGA Solder Ball Inspection |
• X-Ray Inspection |
• 3D CT X-Ray |
• Scanning Acoustic Tomography (SAT) |
• Cross Section |
• Material Analysis |
 Design Verification |
• HALT/HASS |
• Reliability Demonstration (MTBF) |
• Acoustic Noise (Sound Pressure & Sound Power) |
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